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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11850684 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Feb. 11, 2020

Wave solder pallets for optimal solder flow and methods of manufacturing

Applicant:

Flex Ltd, Singapore, SG;

Inventors:

Zohair Mehkri, San Jose, CA (US);

Anwar Mohammed, San Jose, CA (US);

Jesus Tan, San Jose, CA (US);

David Geiger, Dublin, CA (US);

Murad Kurwa, San Jose, CA (US);

Assignee:

FLEX LTD, Singapore, SG;

Attorney:

WEBER ROSSELLI & CANNON LLP

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 3/08 (2006.01); H05K 3/34 (2006.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B29C 64/393 (2017.01); B23K 1/08 (2006.01); B29C 64/106 (2017.01); B29C 64/112 (2017.01); B23K 3/06 (2006.01); H05K 13/04 (2006.01); B33Y 10/00 (2015.01); B29L 31/34 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); B23K 1/085 (2013.01); B23K 3/0653 (2013.01); B23K 3/087 (2013.01); B29C 64/106 (2017.08); B29C 64/112 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); H05K 3/3447 (2013.01); H05K 3/3468 (2013.01); H05K 13/0465 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/7178 (2013.01); B33Y 10/00 (2014.12); H05K 2203/0165 (2013.01); H05K 2203/0173 (2013.01); H05K 2203/044 (2013.01);
Abstract

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

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