The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Jul. 27, 2018
Applicant:

Maxim Integrated Products, Inc., San Jose, CA (US);

Inventors:

Joy T. Jones, San Jose, CA (US);

Ronald B. Koo, Los Altos, CA (US);

Paul G. Schroeder, San Jose, CA (US);

Albert Song, San Jose, CA (US);

Sudarsan Uppili, Portland, OR (US);

Xiaoming Yan, Campbell, CA (US);

Qi Luo, San Jose, CA (US);

Sean Cahill, Palo Alto, CA (US);

Assignee:

MAXIM INTEGRATED PRODUCTS, INC., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502715 (2013.01); B01L 3/502707 (2013.01); B01L 2300/0636 (2013.01); B01L 2300/0645 (2013.01);
Abstract

A sensor package, a sensor system, and a method for fabricating the sensor package are described that include a sensing chip having dispense chemistry disposed over an array of conductive elements. In an implementation, the sensor package may include a sensing chip that may include at least one conductive element, wherein the at least one conductive element may be part of an array of conductive elements defining a M by N matrix, where M is a number of rows of the at least one conductive element and N is a number of columns of the at least one conductive element. The sensing chip may further include dispense chemistry that may be disposed on the at least one conductive element and at least one contact pad. The sensor package may further include a microfluidic cap that may be positioned over at least a portion of the sensing chip, wherein the microfluidic cap and the sensing chip may define a cavity that may be configured to receive a fluid sample. The microfluidic cap may further include at least one electrode that may be configured to sense an analyte in the fluid sample. The at least one electrode may be coupled to the at lease one contact pad of the sensing chip via a conductive adhesive.


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