The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Mar. 16, 2021
Applicant:

Cnh Industrial Canada, Ltd., Saskatoon, CA;

Inventor:

James W. Henry, Saskatoon, CA;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A01B 79/00 (2006.01); A01B 13/14 (2006.01); A01B 63/00 (2006.01); G01S 13/88 (2006.01); G01V 3/10 (2006.01); A01B 3/24 (2006.01); A01B 63/32 (2006.01);
U.S. Cl.
CPC ...
A01B 79/005 (2013.01); A01B 13/14 (2013.01); A01B 63/008 (2013.01); G01S 13/885 (2013.01); G01V 3/10 (2013.01); A01B 3/24 (2013.01); A01B 63/32 (2013.01);
Abstract

A system for identifying soil layers within a field includes a non-contact-based sensor configured to capture data indicative of a subsurface soil layer within the field. Furthermore, the system includes a computing system communicatively coupled to the non-contact-based sensor. In this respect, the computing system is configured to determine a thickness of the subsurface soil layer in a vertical direction based on the data captured by the non-contact-based sensor. Moreover, the computing system is configured to identify the subsurface soil layer as one of a compaction layer or a B-horizon based on the determined thickness.


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