The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Apr. 29, 2022
Huawei Technologies Co., Ltd., Guangdong, CN;
Xuguang Yang, Dongguan, CN;
Zhiwen Yang, Dongguan, CN;
Shaohua Zhang, Shenzhen, CN;
Zelong Jiao, Beijing, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.