The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Sep. 28, 2018
Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventors:

Takayuki Hashimoto, Tatsuno, JP;

Takuya Ishibashi, Tatsuno, JP;

Hiroyuki Okada, Tatsuno, JP;

Kazuki Nishimura, Tatsuno, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); B29C 51/12 (2006.01); B29C 51/14 (2006.01); B32B 27/08 (2006.01); H03H 9/05 (2006.01); H05K 3/28 (2006.01); H10N 30/02 (2023.01); H10N 30/88 (2023.01); H10N 30/87 (2023.01); B29K 101/10 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1085 (2013.01); B29C 51/12 (2013.01); B29C 51/14 (2013.01); B32B 27/08 (2013.01); H03H 9/059 (2013.01); H05K 3/284 (2013.01); H10N 30/02 (2023.02); H10N 30/875 (2023.02); H10N 30/88 (2023.02); H10N 30/883 (2023.02); B29K 2101/10 (2013.01); B29L 2031/34 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance Dbetween the reference member and the first adjacent member is different from a separation distance Dbetween the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.


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