logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11848481 B1

PDFFull Text
Date of Patent:
Dec. 19, 2023

Filed:

Apr. 04, 2022

Antenna-in-package with frequency-selective surface structure

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Shih-Chia Chiu, Hsin-Chu, TW;

Yen-Ju Lu, New Taipei, TW;

Wen-Chou Wu, Hsinchu, TW;

Nan-Cheng Chen, Hsin-Chu, TW;

Assignee:

MediaTek Inc., Hsin-Chu, TW;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Hoang V Nguyen

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01Q 21/06 (2006.01); H01L 23/14 (2006.01); H01Q 15/00 (2006.01); H01Q 19/06 (2006.01); H01Q 15/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/145 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01Q 15/0013 (2013.01); H01Q 15/10 (2013.01); H01Q 19/062 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01);
Abstract

A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

Find Patent Forward Citations

Chiu, Shih-Chia. (2023). Antenna-in-package with frequency-selective surface structure (U.S. Patent No. 11848481). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11848481

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…