The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
May. 20, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Disclosed is a semiconductor package comprising a substrate, a chip stack including semiconductor chips stacked in an ascending stepwise shape on the substrate, first power/ground wires through which the substrate is connected to a lowermost semiconductor chip of the chip stack and neighboring semiconductor chips of the chip stack are connected to each other, and a second power/ground wire that extends from a first semiconductor chip and is connected to the substrate. The first semiconductor chip is one semiconductor chip other than the lowermost semiconductor chip and an uppermost semiconductor chip of the chip stack. The chip stack includes a first stack and a second stack on the first stack. The second stack constitutes a channel separate from that of the first stack.