The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Mar. 19, 2020
Applicant:

Arcsoft Corporation Limited, Hangzhou Zhejiang, CN;

Inventor:

Byung Il Min, Hangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); G02B 3/00 (2006.01); G02B 5/00 (2006.01); H01L 27/146 (2006.01); H04N 25/40 (2023.01); H04N 25/75 (2023.01); G06V 40/13 (2022.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); G02B 3/0056 (2013.01); G02B 5/005 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H04N 25/40 (2023.01); H04N 25/75 (2023.01); G06V 40/1318 (2022.01); H01L 23/538 (2013.01); H01L 27/14605 (2013.01);
Abstract

The present invention relates to a tiled image sensor. The tiled image sensor includes: a substrate on which conductive wiring is formed; and a plurality of image sensor dies arranged on the substrate to be spaced apart from each other by a first distance and electrically connected to the conductive wiring. The image sensor die includes: a plurality of light receiving sub-regions formed to be spaced apart from each other by a second distance; a peripheral circuit that is formed between the plurality of light receiving sub-regions, converts pixel current generated for each pixel included in the plurality of light receiving sub-regions into image data, and outputs the image data in block units; and a contact pad, the contact pad formed on a surface of the image sensor die to electrically connect the image sensor die to the substrate.


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