The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Mar. 31, 2021
Applicant:
Realtek Semiconductor Corporation, Hsinchu, TW;
Inventors:
Cheng-Wei Luo, Hsinchu, TW;
Chieh-Pin Chang, Hsinchu, TW;
Kai-Yi Huang, Hsinchu, TW;
Ta-Hsun Yeh, Hsinchu, TW;
Assignee:
REALTEK SEMICONDUCTOR CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/50 (2006.01); H01L 27/01 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/50 (2013.01); H01L 27/01 (2013.01); H01L 2223/6655 (2013.01);
Abstract
A semiconductor structure includes a first inductor, a second inductor, and a first input/output (I/O) pad. The first I/O pad is coupled to the first inductor and the second inductor. The first I/O pad, a first central axis of a first magnetic field of the first inductor, and a second central axis of a second magnetic field of the second inductor are disposed sequentially along a first direction.