The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Dec. 11, 2019
Applicant:
Aisin Corporation, Aichi, JP;
Inventors:
Takanobu Naruse, Kariya, JP;
Hiroyoshi Araki, Kariya, JP;
Assignee:
AISIN CORPORATION, Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); H01L 23/467 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H01L 23/3672 (2013.01); H01L 23/4334 (2013.01); H05K 7/20145 (2013.01);
Abstract
A semiconductor device () includes a semiconductor module () and a fan device (). The semiconductor module () includes a module board (), a first element () mounted on the module board (), and a second element () having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (), the fan device () is disposed downstream of the first element () and the second element (), and the first element () is disposed downstream of the second element ().