logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11848215 B1

PDFFull Text
Date of Patent:
Dec. 19, 2023

Filed:

Mar. 19, 2019

Method for manufacturing electronic device

Applicant:

Mitsui Chemicals Tohcello, Inc., Tokyo, JP;

Inventors:

Kouji Igarashi, Nordrhein-Westfalen, DE;

Jin Kinoshita, Nagoya, JP;

Hiroyoshi Kurihara, Nagoya, JP;

Toru Miura, Nagoya, JP;

Assignee:

MITSUI CHEMICALS TOHCELLO, INC., Tokyo, JP;

Attorney:

BUCHANAN INGERSOLL & ROONEY PC

Primary Examiner:

Elias Ullah

Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 7/38 (2018.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); C09J 5/00 (2006.01); C09K 3/10 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); C09J 5/00 (2013.01); C09J 7/385 (2018.01); C09K 3/10 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 24/96 (2013.01); B32B 2457/00 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/502 (2020.08); C09J 2433/00 (2013.01); C09K 2200/0647 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/95001 (2013.01);
Abstract

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

Find Patent Forward Citations

Loading…