The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Jun. 02, 2023
Applicant:

Apogee Semiconductor, Inc., Plano, TX (US);

Inventors:

Mark Hamlyn, Murphy, TX (US);

David A. Grant, London, GB;

Assignee:

Apogee Semiconductor, Inc., Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H03K 19/003 (2006.01); H03K 19/013 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4072 (2013.01); H01L 27/0203 (2013.01); H01L 27/092 (2013.01); H03K 19/00315 (2013.01); H03K 19/0136 (2013.01);
Abstract

CMOS output stages, electrostatic discharge (ESD) protection circuits and input bus-keeper functions are provided that block dc and ac leakage paths within inactive powered-down integrated circuits used in redundant high-reliability system configurations employing cold-sparing to provide backup circuitry. These circuits and methods avoid both undesirable power consumption in a cold-spared backup unit and loading of connected active units when powered down, without compromising performance or functionality of the backup unit when in its active powered state. Inputs and outputs using an analog majority voting principle to implement in-circuit redundancy for on-chip fault tolerance are also provided, incorporating the low-leakage principles of the invention for low power dissipation when powered down. Such on-chip redundancy can harden an IC against various faults, such as single-event effects in high-radiation environments, while maintaining the other advantages in a cold-sparing system.


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