The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Dec. 28, 2020
Applicant:

Beijing Voyager Technology Co., Ltd., Beijing, CN;

Inventors:

Yue Lu, Mountain View, CA (US);

Youmin Wang, Mountain View, CA (US);

Anan Pan, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 17/931 (2020.01); G02B 26/12 (2006.01); G01S 7/487 (2006.01); G02B 26/08 (2006.01); G01S 7/481 (2006.01);
U.S. Cl.
CPC ...
G01S 17/931 (2020.01); G01S 7/4876 (2013.01); G02B 26/0833 (2013.01); G02B 26/122 (2013.01); G01S 7/4817 (2013.01);
Abstract

In one example, a method of fabricating a polygon assembly of a Light Detection and Ranging (LiDAR) module is provided. The method comprises: forming, on a backside surface of a first silicon-on-insulator (SOI) substrate, a multi-facet polygon of the polygon assembly; forming, on a frontside surface of the first SOI substrate, an axial portion of a support structure of the polygon assembly, the axial portion forming a stack with the polygon along a rotation axis; forming, on a frontside surface of a second SOI substrate, a plurality of radial portions of the support structure; forming, on a backside surface of the second SOI substrate, a cavity that encircles the plurality of radial portions; and bonding, based on a wafer bonding operation, the axial portion to the plurality of radial portions to form the polygon assembly.


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