The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Dec. 28, 2016
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Matthew J. Schmid, Roberts, WI (US);

Cyrus A. Anderson, Bellingham, WA (US);

Kathleen S. Shafer, Woodbury, MN (US);

Xiao Gao, Woodbury, MN (US);

James M. Nelson, Woodbury, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 4/00 (2006.01); C09J 5/00 (2006.01); C08L 33/08 (2006.01); C09J 7/38 (2018.01); C08K 5/03 (2006.01); C08K 5/06 (2006.01); C08K 5/5397 (2006.01); C08L 33/10 (2006.01); C08L 71/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08L 33/08 (2013.01); C09J 4/00 (2013.01); C09J 5/00 (2013.01); C09J 7/38 (2018.01); C08K 5/03 (2013.01); C08K 5/06 (2013.01); C08K 5/5397 (2013.01); C08L 33/10 (2013.01); C08L 71/00 (2013.01); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08);
Abstract

Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradiated by a first actinic light source to polymerize the first curable resin without polymerizing the second curable resin to provide a partially cured adhesive. The partially cured adhesive is a pressure-sensitive adhesive that displays cold flow creep recovery under ambient conditions and is capable of being fully cured by irradiating the partially cured adhesive using a second actinic light source that is different from the first actinic light source to polymerize the second curable resin.


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