logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11845246 B1

PDFFull Text
Date of Patent:
Dec. 19, 2023

Filed:

Jan. 09, 2020

Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Takashi Kino, Tokyo, JP;

Soonyong Park, Daejeon, KR;

Youngseok Park, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

BRYAN CAVE LEIGHTON PAISNER LLP

Primary Examiner:

John Vincent Lawler

Int. Cl.
CPC ...
B32B 27/28 (2006.01); B29C 48/00 (2019.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 37/15 (2006.01); B32B 38/10 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B29C 48/0021 (2019.02); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 37/15 (2013.01); B32B 38/10 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2457/08 (2013.01); C08G 73/1067 (2013.01);
Abstract

Provided is a film including a matrix layer formed with polyimide for a matrix obtained from pyromellitic dianhydride and m-tolidine, a first adhesive layer formed on one surface of the matrix layer and formed with first thermoplastic polyimide, and a second adhesive layer formed on the other surface of the matrix layer and formed with second thermoplastic polyimide, wherein maximum height roughness of a first interface between the matrix layer and the first adhesive layer and maximum height roughness of a second interface between the matrix layer and the second adhesive layer are 1.0 μm or less.

Find Patent Forward Citations

Kino, Takashi. (2023). Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate (U.S. Patent No. 11845246). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11845246

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…