The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Jul. 14, 2021
Applicant:

The Boeing Company, Chicago, IL (US);

Inventor:

Nathan D. Hiller, Irvine, CA (US);

Assignee:

The Boeing Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/35 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B29C 64/386 (2017.01); G01N 21/94 (2006.01); B33Y 50/00 (2015.01); B33Y 80/00 (2015.01); B29C 64/153 (2017.01); B29C 64/268 (2017.01); B29C 64/218 (2017.01); B29K 105/12 (2006.01);
U.S. Cl.
CPC ...
B29C 64/35 (2017.08); B29C 64/153 (2017.08); B29C 64/218 (2017.08); B29C 64/268 (2017.08); B29C 64/386 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); G01N 21/94 (2013.01); B29K 2105/124 (2013.01); B29K 2995/0008 (2013.01); B29K 2995/0012 (2013.01); B29K 2995/0044 (2013.01); B33Y 50/00 (2014.12);
Abstract

An additive manufacturing system for extraction of impurities in additive manufacturing material, the system including an additive manufacturing machine for manufacturing a part using additive manufacturing material. The system may additionally include a conductive plate adjacent to the additive manufacturing material. The system can further include an energy source for distributing an electric charge through the conductive plate adjacent to the additive manufacturing material. Distributing the electric charge through the conductive plate can attract impurities from the additive manufacturing material to the conductive plate.


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