The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

May. 01, 2020
Applicants:

Massachusetts Institute of Technology, Cambridge, MA (US);

President and Fellows of Harvard College, Cambridge, MA (US);

Inventors:

Theodore H. Fedynyshyn, Sudbury, MA (US);

Jennifer A. Lewis, Cambridge, MA (US);

Bradley P. Duncan, Andover, MA (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); B29C 64/165 (2017.01); B29C 64/209 (2017.01); B05D 5/08 (2006.01); C09D 5/24 (2006.01); H01L 23/498 (2006.01); H01B 1/00 (2006.01); G03G 5/05 (2006.01); G03G 5/07 (2006.01); H01M 10/653 (2014.01); H01M 4/66 (2006.01); H05K 1/09 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 105/00 (2006.01); B29L 31/34 (2006.01); G01N 33/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B05D 5/083 (2013.01); B29C 64/209 (2017.08); C09D 5/24 (2013.01); G03G 5/05 (2013.01); G03G 5/07 (2013.01); H01B 1/00 (2013.01); H01L 23/49883 (2013.01); H01M 4/663 (2013.01); H01M 10/653 (2015.04); H05K 1/092 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2025/06 (2013.01); B29K 2105/251 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0008 (2013.01); B29K 2995/0088 (2013.01); B29K 2995/0093 (2013.01); B29K 2995/0094 (2013.01); B29L 2031/3456 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); G01N 2033/0095 (2013.01); H05K 2201/015 (2013.01); H05K 2201/03 (2013.01);
Abstract

A 3-D printed device comprising one or more structures, the structures comprising a plurality of magnetically responsive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a magnetic ink composition; applying the magnetic ink composition to a substrate in a 3-D solvent cast printing process to form one or more structures; and drying the one or more structures formed from the magnetic ink composition. The dried structures can exhibit one or more regions of magnetic permeability greater than 1.3×10H/m.


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