The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Jan. 28, 2021
Seiko Epson Corporation, Tokyo, JP;
Kakeru Sasagawa, Matsumoto, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
Abstract
An injection molding apparatus includes: a molding mold including a fixed mold in which a gate into which a molding material flows is formed, and a movable mold in which a cavity portion is formed and which is separated from the fixed mold when the mold is opened; a nozzle in which a flow path that guides the molding material to the gate is formed; and a first cooling plate which is detachably attached to an opposite-side surface of the movable mold from a surface to be in contact with the fixed mold and which is provided with a first cooling mechanism therein, and the first cooling mechanism cools the molding material in the cavity portion.