The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Feb. 16, 2021
Seiko Epson Corporation, Tokyo, JP;
Ríona Hayashi, Shiojiri, JP;
Kenta Anegawa, Matsumoto, JP;
Kakeru Sasagawa, Matsumoto, JP;
Hiroki Takano, Matsumoto, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
Abstract
An injection molding apparatus including a fixed die including a gate via which a molding material flows in, a movable die that forms along with the fixed die a cavity and separates from the fixed die at a point of time of mold opening, an open-gate hot runner that includes a nozzle including a channel that guides the molding material to the gate and a heater that heats the channel, the hot runner being attachable to and detachable from the fixed die, and a cap member that is disposed between the fixed die and the hot runner and has a melting point higher than a melting point of the molding material.