The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Jun. 08, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Thomas Anthony, Palo Alto, CA (US);

Seongsik Chang, Palo Alto, CA (US);

Keith Edward Moore, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/00 (2021.01); B33Y 30/00 (2015.01); B22F 12/50 (2021.01); B22F 12/63 (2021.01); B22F 10/20 (2021.01); B22F 10/10 (2021.01); B22F 10/37 (2021.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B22F 10/00 (2021.01); B22F 10/20 (2021.01); B22F 12/50 (2021.01); B22F 12/63 (2021.01); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B22F 10/10 (2021.01); B22F 10/37 (2021.01); B22F 2202/06 (2013.01);
Abstract

A system to apply uniform layers of metal powder, the system includes: a conductive roller with a dielectric coating, the conductive roller biased at a first voltage; a powder supply to contain a metal powder biased at a second voltage, the powder supply to provide the metal powder to the conductive roller to form a uniform layer of metal powder on the dielectric coating of the conductive roller; a deposition area to receive the uniform layer of metal powder from the conductive roller, the deposition area biased at a third voltage, wherein the metal powder is transferred across an air gap from the conductive roller to the deposition area by electrostatic attraction of the metal powder.


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