The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Aug. 02, 2021
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Jerry Weiming Kuo, Sunnyvale, CA (US);

Peter Joseph Bevelacqua, Sunnyvale, CA (US);

Leigh Margaret Cormie, Mountain View, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H04B 1/38 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H04B 1/38 (2013.01);
Abstract

The present disclosure describes aspects of an antenna-in-package (AiP) transceiver module and associated methods and systems. In aspects, an AiP transceiver module includes a substrate of dielectric material and first and second layers of conductive material disposed on respective surfaces of the substrate. The first layer of conductive material disposed on a first surface of the substrate includes an antenna element and antenna feed pad to which a contact of a transceiver integrated circuit die is coupled. The second surface of the substrate includes a dielectric interface area that is opposite to an area on the first surface of the substrate in which the antenna element is disposed and excludes the second layer of conductive material. The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element, such that a volume of the dielectric material includes an air gap below the module.


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