The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

May. 12, 2022
Applicant:

Playnitride Display Co., Ltd., Zhunan Township, Miaoli County, TW;

Inventors:

Shiang-Ning Yang, Zhunan Township, Miaoli County, TW;

Chih-Ling Wu, Zhunan Township, Miaoli County, TW;

Yi-Min Su, Zhunan Township, Miaoli County, TW;

Bo-Wei Wu, Zhunan Township, Miaoli County, TW;

Assignee:

PLAYNITRIDE DISPLAY CO., LTD., Zhunan Township, Miaoli County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 31/16 (2006.01); H01L 31/14 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 31/143 (2013.01); H01L 31/162 (2013.01);
Abstract

A semiconductor structure includes a substrate, a plurality of micro semiconductor devices and a fixing structure. The micro semiconductor devices are disposed on the substrate. The fixing structure is disposed between the substrate and the micro semiconductor devices. The fixing structure includes a plurality of conductive layers and a plurality of supporting layers. The conductive layers are disposed on the lower surfaces of the micro semiconductor devices. The supporting layers are connected to the conductive layers and the substrate. The material of each of the conductive layers is different from the material of each of the supporting layers.


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