The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Aug. 08, 2018
Applicant:

Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;

Inventors:

Takehiko Tanaka, Yuyao, CN;

Zhenyu Chen, Yuyao, CN;

Zhewen Mei, Yuyao, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); B29C 45/14 (2006.01); B29C 45/37 (2006.01); H04N 23/55 (2023.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); B29C 45/14336 (2013.01); B29C 45/37 (2013.01); H01L 27/14627 (2013.01); H01L 27/14683 (2013.01); H04N 23/55 (2023.01); B29C 2793/009 (2013.01); B29L 2011/00 (2013.01);
Abstract

Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.


Find Patent Forward Citations

Loading…