The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Feb. 01, 2021
Chongqing Boe Optoelectronics Technology Co., Ltd., Chongqing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Zhiyong Ning, Beijing, CN;
Zhonghao Huang, Beijing, CN;
Chao Zhang, Beijing, CN;
Zhaojun Wang, Beijing, CN;
Hongru Zhou, Beijing, CN;
Yutong Yang, Beijing, CN;
Rui Wang, Beijing, CN;
Xu Wu, Beijing, CN;
Kunkun Gao, Beijing, CN;
Chongqing BOE Optoelectronics Technology Co., Ltd., Chongqing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
A half via hole structure, a method for manufacturing the same, an array substrate, and a display panel are provided. The half via hole structure includes: a spacer layer arranged on an underlaying substrate; a passivation layer arranged on the spacer layer and provided with a first via hole, an orthographic projection of the first via hole on the underlaying substrate being within that of the spacer layer on the underlaying substrate; a first conductive layer arranged on the spacer layer and having a width smaller than a diameter of the first via hole; an insulating layer arranged between the spacer layer and the passivation layer and provided with a second via hole; and a second conductive layer arranged on the passivation layer and overlapped with the first conductive layer through the first via hole.