The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Oct. 17, 2019
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Mathias Wendt, Hausen, DE;

Simeon Katz, Regensburg, DE;

Pascal Porten, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13669 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17515 (2013.01); H01L 2224/8102 (2013.01); H01L 2224/81031 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/1204 (2013.01);
Abstract

The method of producing an electronic component () comprises a step A) of providing a semiconductor chip () having an underside (), having a plurality of contact pins (), and having at least one positioning pin () protruding from the underside. The contact pins are adapted to electrically contact the semiconductor chip. The positioning pin narrows in the direction away from the underside and protrudes further from the underside than the contact pins. The semiconductor chip is placed on the connection carrier, with the contact pins each being inserted into a contact recess and the positioning pin being inserted into the positioning recess. The contact pins are immersed in the molten solder material.


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