The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Mar. 02, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A package module includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and having a connection pad electrically connected to the one or more redistribution layers, a plurality of electronic components disposed on the connection structure and electrically connected to the one or more redistribution layers, one or more frames disposed on the connection structure, and an encapsulant disposed on the connection structure, and respectively covering at least portions of the semiconductor chip, the plurality of electronic components, and the one or more frames. At least a portion of an outer side surface of the encapsulant is coplanar on the same level as at least a portion of an outer side surface of at least one of the one or more frames.