The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Oct. 22, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); H01L 23/4985 (2013.01); H01L 25/18 (2013.01); H05K 1/0204 (2013.01); H05K 1/189 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H05K 1/147 (2013.01); H05K 2201/10128 (2013.01);
Abstract
A chip-on-film package includes a base film including an upper surface and a lower surface that opposite from each other, a semiconductor chip mounted on the upper surface of the base film, a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction, an insulating layer disposed on a lower surface of the heat emission layer, and a protective layer surrounding side and lower surfaces of the insulating layer. Accordingly, thermal fatigue of the chip-on-film package may be reduced, and reliability may be increased.