The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Sep. 29, 2020
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Keiji Hirabayashi, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/683 (2006.01); G03F 7/00 (2006.01); C23C 16/02 (2006.01); C23C 16/27 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); C23C 16/0272 (2013.01); C23C 16/27 (2013.01); C23C 16/458 (2013.01); G03F 7/707 (2013.01); H01L 21/6838 (2013.01);
Abstract
A wafer chuck includes a base made of a ceramic containing silicon carbide. The base has an oxidation-treated layer, and a film made of diamond-like carbon (DLC) is formed on an outermost surface of the base.
Hirabayashi, Keiji. (2023). Wafer chuck, method for producing the same, and exposure apparatus (U.S. Patent No. 11842918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11842918
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile