The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Apr. 14, 2023
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Yuuki Takami, Osaka, JP;
Kazunari Fukagawa, Osaka, JP;
Ryuuichi Toyota, Osaka, JP;
Natsuko Kitagawa, Osaka, JP;
Yumi Aomatsu, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/684 (2006.01); F24F 11/89 (2018.01); F24F 110/30 (2018.01); F24F 110/10 (2018.01);
U.S. Cl.
CPC ...
G01F 1/684 (2013.01); F24F 11/89 (2018.01); F24F 2110/10 (2018.01); F24F 2110/30 (2018.01);
Abstract
A thermal flow velocity and flow rate sensor includes: a substrate; a heater mounted on the substrate; a temperature measuring element mounted on the substrate; a joint portion made of a resin filled between the heater and the temperature measuring element and thermally connecting the heater and the temperature measuring element; a lead wire connected to the substrate; and a fastener fixing the lead wire to the substrate. The lead wire is soldered to the substrate. The lead wire and the fastener are coated with the resin.