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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11840602 B1

PDFFull Text
Date of Patent:
Dec. 12, 2023

Filed:

Dec. 18, 2020

Laminate, circuit board, and liquid crystal polymer film applied to the same

Applicant:

Chang Chun Plastics Co., Ltd., Taipei, TW;

Inventors:

An-Pang Tu, Taipei, TW;

Chien-Chun Chen, Taipei, TW;

Chia-Hung Wu, Taipei, TW;

Assignee:

CHANG CHUN PLASTICS CO., LTD., Taipei, TW;

Attorney:

WPAT, PC

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 15/04 (2006.01); C08G 63/06 (2006.01); C08G 63/83 (2006.01); C08J 5/18 (2006.01); H05K 1/03 (2006.01); B32B 15/20 (2006.01); B32B 15/09 (2006.01); B32B 27/36 (2006.01); C08G 63/60 (2006.01); C08L 67/04 (2006.01); C09K 19/38 (2006.01); B29C 41/12 (2006.01); B29D 7/01 (2006.01); B29K 67/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08G 63/065 (2013.01); B29C 41/12 (2013.01); B29D 7/01 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); C08G 63/06 (2013.01); C08G 63/60 (2013.01); C08G 63/83 (2013.01); C08J 5/18 (2013.01); C08L 67/04 (2013.01); C09K 19/3809 (2013.01); H05K 1/032 (2013.01); B29K 2067/00 (2013.01); B29K 2105/0079 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2305/55 (2013.01); B32B 2307/538 (2013.01); B32B 2307/704 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08G 2250/00 (2013.01); C08J 2367/04 (2013.01); C08L 2203/16 (2013.01); H05K 2201/0141 (2013.01);
Abstract

Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df'), a dissipation factor after water absorption (Df′), and a relative percentage difference between dissipation factors (ΔDf′), which is calculated by the following equation: wherein ΔDf′ may be less than or equal to 16%. By controlling ΔDf′ of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited. In addition, the difference between the insertion losses of signal transmission before and after water absorption is decreased, so the laminate is suitable for high-end or outdoor high-frequency electronic products.

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