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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11840601 B1

PDFFull Text
Date of Patent:
Dec. 12, 2023

Filed:

Nov. 03, 2020

Composition of alkoxysilyl-functionalized epoxy resin and composite thereof

Applicant:

Korea Institute of Industrial Technology, Cheonan, KR;

Inventors:

Hyun Aee Chun, Suwon, KR;

Sook Yeon Park, Gunpo, KR;

Su Jin Park, Osan, KR;

Yun Ju Kim, Seoul, KR;

Assignee:

KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, Cheonan, KR;

Attorney:
Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08L 63/00 (2006.01); C08F 220/18 (2006.01); C08F 220/56 (2006.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/3281 (2013.01); C08F 220/1802 (2020.02); C08F 220/1804 (2020.02); C08F 220/56 (2013.01); C08G 59/245 (2013.01); C08G 59/306 (2013.01); C08G 59/4269 (2013.01); C08G 59/686 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08L 63/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/005 (2013.01); C08L 2203/20 (2013.01); C08L 2203/30 (2013.01);
Abstract

An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

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