The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jun. 22, 2022
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Kohei Matsuda, Kanagawa, JP;
Kentaro Kawata, Shizuoka, JP;
Taku Watanabe, Shizuoka, JP;
Atsushi Toda, Shizuoka, JP;
Shun Sato, Kanagawa, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 37/04 (2006.01); B65H 37/06 (2006.01);
U.S. Cl.
CPC ...
B65H 37/04 (2013.01); B65H 37/06 (2013.01); B65H 2301/51614 (2013.01); B65H 2301/51616 (2013.01); B65H 2801/06 (2013.01); B65H 2801/27 (2013.01);
Abstract
A sheet bonding apparatus includes an electrophotographic unit configured to apply powder adhesive on a sheet by an electrophotographic process, a folding portion configured to fold the sheet on which the powder adhesive has been applied by the electrophotographic unit, and a bonding portion configured to heat the sheet folded by the folding portion to bond the sheet by the powder adhesive, wherein the bonding portion and the folding portion are disposed over the electrophotographic unit.