The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jul. 13, 2022
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
John Rossi, Vancouver, WA (US);
Erik D. Ness, Vancouver, WA (US);
James Michael Gardner, Corvallis, OR (US);
Scott A. Linn, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/36 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/0454 (2013.01); B41J 2/04541 (2013.01); B41J 2/04546 (2013.01); B41J 2/04563 (2013.01); B41J 2/04586 (2013.01);
Abstract
An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.