The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
May. 24, 2019
Vkr Holding A/s, Hørsholm, DK;
Kristian Damholdt Jørgensen, Hørsholm, DK;
Thomas Villiam Sejer Mikkelsen, Hørsholm, DK;
Karsten Hansgaard Nielsen, Hørsholm, DK;
Thomas Lind Madsen, Hørsholm, DK;
Henrik Aslak Jensen, Hørsholm, DK;
Willibrordus Servatius Bouwens, Hørsholm, DK;
VKR HOLDING A/S, Horsholm, DK;
Abstract
The present disclosure relates to a method of providing a laminated vacuum insulated glass (VIG) unit, wherein the method comprises: —providing a lamination assembly () comprising a vacuum insulated glass (VIG) unit () comprising at least two glass sheets () separated by a plurality of support structures () distributed in a gap () between the glass sheets (), and a lamination layer () arranged between one of the glass sheets () of the vacuum insulated glass (VIG) unit () and a further sheet (). The lamination assembly () is subjected to a heating step at a heating location so as to soften the lamination layer to provide a bonding between the vacuum insulated glass unit and the lamination layer (), and a bonding between the further sheet () and the lamination layer (). The heated lamination assembly () is then subjected to a cooling step provided by a cooling system (), wherein said cooling step comprises providing a controlled cooling of one or both major outer surfaces () of the heated lamination assembly () so as to cool said heated lamination assembly () to harden said lamination layer (). The present disclosure additionally relates to use of a cooling system.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile