The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Mar. 29, 2018
Applicant:

Toyo Kohan Co., Ltd, Tokyo, JP;

Inventors:

Yusuke Hashimoto, Yamaguchi, JP;

Kota Sadaki, Yamaguchi, JP;

Teppei Kurokawa, Yamaguchi, JP;

Takashi Koshiro, Yamaguchi, JP;

Takafumi Hatakeda, Yamaguchi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B32B 15/01 (2006.01); B23K 20/04 (2006.01); B32B 15/20 (2006.01); C23F 4/00 (2006.01); B23K 103/10 (2006.01); B23K 103/04 (2006.01);
U.S. Cl.
CPC ...
B32B 15/012 (2013.01); B23K 20/04 (2013.01); B32B 15/20 (2013.01); C23F 4/00 (2013.01); B23K 2103/05 (2018.08); B23K 2103/10 (2018.08);
Abstract

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion Pof thickness Tof the stainless steel layer relative to thickness T and a half width FWHMof a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM≤0.0057P+0.4.


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