The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Sep. 30, 2020
Csp Technologies, Inc., Auburn, AL (US);
Donald Huber, Auburn, AL (US);
Jonathan R. Freedman, Auburn, AL (US);
Brian Tifft, Summerville, SC (US);
Franklin Lee Lucas, Jr., Opelika, AL (US);
CSP Technologies, Inc., Auburn, AL (US);
Abstract
A method of over-molding materials includes: providing a first material in a groove in a first portion of a mold such that only a single surface of the first material is exposed to a vacant portion of the mold; providing, via an injection molding process, a second material in a liquid form in the vacant portion of the mold adjacent to, and in engagement with, the first material; and allowing the second material to solidify and become directly coupled to the first material, thus forming a single component. During the method, the entire single surface of the first material is flush with a plane defined by outer surface of the first portion of the mold. The second material has one or both of a greater hardness when solidified than the first material and/or a higher melting temperature than the first material.