The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Jan. 13, 2022
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Yonghai Mao, Dongguan, CN;

Zhenming Hu, Hangzhou, CN;

Jianqiang Yin, Dongguan, CN;

Xiaofei Li, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20872 (2013.01); H05K 1/0203 (2013.01); H05K 7/20172 (2013.01); H05K 7/20854 (2013.01); H05K 7/20881 (2013.01); H05K 7/20254 (2013.01); H05K 7/20336 (2013.01); H05K 7/20454 (2013.01); H05K 7/20863 (2013.01);
Abstract

This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.


Find Patent Forward Citations

Mao, Yonghai. (2023). Temperature equalizing vehicle-mountable device (U.S. Patent No. 11839065). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11839065

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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