The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Apr. 09, 2020
Applicant:

Chang-yuan Wu, Taipei, TW;

Inventor:

Chang-Yuan Wu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20445 (2013.01); H05K 7/20172 (2013.01);
Abstract

A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.


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