The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Sep. 24, 2021
Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Xiaoxia Wang, Beijing, CN;
Shouyang Leng, Beijing, CN;
Qing Ma, Beijing, CN;
Rui Han, Beijing, CN;
Jie Yu, Beijing, CN;
Dong Cui, Beijing, CN;
Pengtao Li, Beijing, CN;
Tielei Zhao, Beijing, CN;
Chunhua Wang, Beijing, CN;
Xiaoqiao Dong, Beijing, CN;
Yaoyao Wang, Beijing, CN;
Jing Yu, Beijing, CN;
Beijing BOE Optoelectronics Technology Co., Ltd., Beijing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
A flexible printed circuit and manufacturing method thereof, and a displaying device. A wiring layer is arranged on a flexible substrate, a reinforcing layer is arranged on a side of the flexible substrate away from the wiring layer, the wiring layer comprises a plurality of signal wirings arranged along a first wiring area, a second wiring area, a third wiring area and a fourth wiring area, and the reinforcing layer comprises a first reinforcing structure located in the second wiring area and a second reinforcing structure located in the fourth wiring area. The impact strength of the flexible printed circuit is increased by arranging the first reinforcing structure in the second wiring area of the flexible substrate and arranging the second reinforcing structure in the fourth wiring area of the flexible substrate.