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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11839023 B1

PDFFull Text
Date of Patent:
Dec. 05, 2023

Filed:

Jan. 06, 2022

Three-dimensional molded circuit component

Applicant:

Maxell, Ltd., Kyoto, JP;

Inventors:

Atsushi Yusa, Nagaokakyo, JP;

Satoshi Yamamoto, Suita, JP;

Akiko Kito, Takatsuki, JP;

Hironori Ota, Ibaraki, JP;

Hideto Goto, Muko, JP;

Naoki Usuki, Osaka, JP;

Assignee:

MAXELL, LTD., Otokuni-Gun, JP;

Attorney:

Oliff PLC

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 33/64 (2010.01); B29C 45/14 (2006.01); B29C 45/26 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); B29L 31/34 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); B29C 45/14 (2013.01); B29C 45/26 (2013.01); H01L 33/64 (2013.01); H05K 1/02 (2013.01); H05K 1/0203 (2013.01); H05K 1/05 (2013.01); H05K 1/11 (2013.01); H05K 1/183 (2013.01); H05K 3/0014 (2013.01); H05K 3/185 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/747 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

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