The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Feb. 10, 2022
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tomohisa Ishigami, Kanagawa, JP;

Makoto Aoki, Tokyo, JP;

Yuya Okada, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 27/146 (2006.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01L 27/14636 (2013.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01);
Abstract

A communication module includes a first wiring board including a plurality of first signal lines and a first ground line, and a second wiring board including a first layer and a second layer. The first layer includes a plurality of second signal lines. The second layer includes a shielding member. The communication module includes a plurality of first connection members via which the plurality of first signal lines are electrically connected to the plurality of second signal lines, and at least one conductive member provided between the first ground line and the shielding member. The at least one conductive member is provided so as to overlap with at least one second signal line among the plurality of second signal lines as viewed in a direction perpendicular to a main surface of the first wiring board.


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