The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Sep. 25, 2020
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Changsheng Pei, Dongguan, CN;

Yongfa Zhu, Dongguan, CN;

Zhiqiang Zeng, Dongguan, CN;

Xiaowei Chen, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 50/12 (2016.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 38/14 (2006.01); H02J 7/04 (2006.01); H02J 50/10 (2016.01);
U.S. Cl.
CPC ...
H02J 50/12 (2016.02); H01F 27/2871 (2013.01); H01F 27/323 (2013.01); H01F 38/14 (2013.01); H02J 7/04 (2013.01); H02J 50/10 (2016.02); H02J 2207/20 (2020.01);
Abstract

This application discloses a coil module, which includes: an insulation layer, a first planar coil winding, and a second planar coil winding, one turn of coil of the first planar coil winding includes a first portion, a second portion, and a first connection part, and one turn of coil of the second planar coil winding includes a third portion, a fourth portion, and a second connection part. The first connection portion connects an outer side part of the first portion and an inner side part of the second portion, the second connection portion connects an inner side part of the third portion and an outer side part of the fourth portion, and there is an overlap between a projection of the first connection portion on a plane of the insulation layer and a projection of the second connection portion on the plane of the insulation layer.


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