The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Dec. 27, 2018
Osram Oled Gmbh, Regensburg, DE;
John Brückner, Regensburg, DE;
Urs Heine, Regensburg, DE;
Sven Gerhard, Alteglofsheim, DE;
Lars Nähle, Bad Abbach, DE;
Andreas Löffler, Neutraubling, DE;
André Somers, Obertraubling, DE;
OSRAM OLED GMBH, Regensburg, DE;
Abstract
A method for singulating semiconductor components () is specified, said method comprising the steps of providing a carrier (), applying at least two semiconductor chips () on the carrier (), etching at least one break nucleus () at a side of the carrier () facing the semiconductor chips (), and singulating at least two semiconductor components () by breaking the carrier () along the at least one break nucleus (). The at least one break nucleus () extends at least in places in a vertical direction (z), the vertical direction (z) being perpendicular to a main extension plane of the carrier (), and the at least one break nucleus () is arranged between the two semiconductor chips () in a lateral direction (x), the lateral direction (x) being parallel to the main extension plane of the carrier (). Further, each of the semiconductor components () comprises at least one of the semiconductor chips (), and the expansion of the at least one break nucleus () in the vertical direction (z) is at least% of the expansion of the carrier () in the vertical direction (z). Furthermore, a semiconductor component () is specified.