The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Jul. 22, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Saqib Kaleem, Munich, DE;

Jonas Eric Sebastian Fritzin, Munich, DE;

Martin Dechant, Graz, AT;

Pietro Brenner, Ebersberg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14141 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip. The device includes an external connection element configured to provide a first coax-like electrical connection between the device and a printed circuit board, wherein the first coax-like electrical connection includes a section extending in a direction vertical to the main surface of the semiconductor chip. The device further includes an electrical redistribution layer arranged over the main surface of the semiconductor chip and configured to provide a second coax-like electrical connection between the electrical contact of the semiconductor chip and the external connection element, wherein the second coax-like electrical connection includes a section extending in a direction parallel to the main surface of the semiconductor chip.


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