The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Dec. 28, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Toru Komatsu, Nagaokakyo, JP;

Tadashi Nomura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01F 27/36 (2006.01); H01F 41/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01F 27/363 (2020.08); H01F 41/005 (2013.01); H01L 25/16 (2013.01);
Abstract

A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.


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