The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Aug. 16, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dong Ho Kim, Hwaseong-si, KR;
Jang Woo Lee, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including: a first substrate including a first surface including a first region and a second region at least partially surrounding the first region, wherein the first substrate includes a first insulating layer, a first conductive pattern in the first insulating layer, a first passivation layer disposed in the first region and the second region, and a second passivation layer disposed on the first passivation layer in the second region; an interposer overlapping the first substrate and including a second insulating layer and a second conductive pattern in the second insulating layer; a first connection terminal disposed on the first passivation layer in the first region; and a second connection terminal disposed on the second passivation layer in the second region, wherein the first conductive pattern and the second conductive pattern are connected to each other through the first connection terminal and the second connection terminal.