The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Jul. 23, 2020
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventor:

Travis Boraten, Austin, TX (US);

Assignee:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/525 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/5252 (2013.01); H01L 23/5256 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01);
Abstract

Various semiconductor chips and chip stack arrangements are disclosed. In one aspect, a semiconductor chip stack is provided that includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first logic layer and a first semiconductor layer on the first logic layer. The first semiconductor layer has plural first through-silicon transistors operable to selectively control the transmission of data from the first semiconductor chip to the second semiconductor chip and has plural first through-silicon vias to convey control signals to the second semiconductor chip.


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