The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Jun. 28, 2023
Applicant:

Semikron Elektronik Gmbh & Co. KG, Nuremberg, DE;

Inventors:

Harald Kobolla, Seukendorf, DE;

Marco Lederer, Nuremberg, DE;

Rainer Popp, Petersaurach, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 7/20 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 23/04 (2013.01); H05K 7/20927 (2013.01);
Abstract

A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.


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