The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Sep. 20, 2021
Fujitsu Limited, Kawasaki, JP;
Shinya Sasaki, Ebina, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
The semiconductor device includes a first semiconductor IC, a second semiconductor IC with a smaller heat generation quantity than the first semiconductor IC, a first heat conduction member covering at least a portion of the first semiconductor IC, a second heat conduction member covering the second semiconductor IC and the first heat conduction member, and a heat dissipation member. The heat dissipation member covers the second heat conduction member and dissipates heat produced from the first semiconductor IC and second semiconductor IC to the exterior. A thermal conductivity of the first heat conduction member is lower than a thermal conductivity of the second heat conduction member in a horizontal direction, which is a direction in which the first semiconductor IC and the second semiconductor IC are arrayed.