The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Jul. 17, 2020
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sebastian Meier, Munich, DE;

Bernhard Peter Lange, Freising, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/053 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); G01N 27/28 (2006.01); G01N 27/416 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); G01N 27/28 (2013.01); G01N 27/4167 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01);
Abstract

In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.


Find Patent Forward Citations

Loading…